EIPEKS OFFICIAL
Our company boasts a state-of-the-art optoelectronic hybrid integrated device packaging and testing center, occupying an area of over 700 square meters, with an internal Class 10,000 cleanroom spanning approximately 300 square meters. We possess advanced micrometer-level technology, enabling precise assembly and processing of optoelectronic hybrid devices, including bonding, eutectic welding, chip adhesion, coupling, and sealing processes.
